21st Asia Pacific Nanotechnology Congress

Nano Coating

Nano coating is a surface engineering process by atomistic or molecular deposition of less than 100 nm thin films. Thus, the thickness Nano coating films from these processes are quite different from bulk coating methods such as dipping and roll-over-knife etc. There are many techniques to accomplish the atomistic/molecular deposition on a given substrate: physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, electro less plating, laser vaporization, plasma enhanced chemical vapor deposition (PECVD), etc. According to the operating environment, PVD processes are further divided into vacuum evaporation, sputter deposition, ion plating and ion beam-assisted deposition. The typical PVD deposition rate is 1 to 10 nm/s. The quasi-reactive sputter deposition of indium tin oxide (ITO) conductive films can be obtained from an ITO sputtering target using a partial pressure of oxygen in the plasma. The thermal CVD is the unseating of atoms or molecules by the increased temperature reduction or decomposition of a chemical vapor precursor species which contains the material to be placed. For polymer film deposition, plasma-based CVD can be used (plasma polymerization).